July 1, 2026
Dr. Youngchan Kim joins Jeong Research Group as a postdoctoral scholar. He will research semiconductor packaging processes, including fs-laser processing, micromachining, and laser ablation. Welcome Youngchan!
May 18, 2026
Two of my students were named finalists in the IISE Manufacturing & Design (M&D) Division Best Student Paper Competition — 2 of the 4 finalists:
• Mishfaqur Rahman — "Thermal Characterization of Sigma-Level Defect Variability in Microbump-Based Semiconductor Packaging"
• Hyeonsu Lee — "Material-Agnostic Temperature Prediction in Metal Additive Manufacturing via Parametric Physics-Informed Neural Networks"
Dr. Jeong also received the IISE M&D Division Outstanding Early Career (OEC) Award (https://lnkd.in/gwTjiM6z).
Congratulations, all! :)
Apr 6, 2026
Our very first paper, led entirely by our own group members, has been accepted for publication in the CIRP Annals: "In-situ temperature and emissivity monitoring of blue laser powder-blown directed energy deposition of copper" [link]
In this work, we developed an in-situ monitoring framework for blue laser powder-blown directed energy deposition (LP-DED) of copper, combining multispectral thermometry (MST) and photodiode-based Planck thermometry (PDPT) to capture spatially resolved temperature and emissivity maps in real time — a foundation for future closed-loop control.
This work will be presented at the 75th CIRP General Assembly 2026 in Torino this August 🇮🇹.
Jan 12, 2026
Md Nazmus Sakib joins Jeong Research Group as a PhD student. He will research Metal Additive Manufacturing. Welcome Sakib!
Aug 15, 2025
Hyeonsu Lee joins Jeong Research Group as a PhD student. He will research physics-informed machine learning in manufacturing processes. Welcome Hyeonsu!
Jun 26, 2025
Dr. Jeong was awarded one of two Outstanding Papers in Manufacturing Processes in NAMRC53 based on his postdoctoral work at Northwestern University:
"Directed Energy Deposition on Sheet Metal Forming for Reinforcement Structures" was published in the Journal of Manufacturing Processes.
Jun 1, 2025
Jeong Research Group has secured 3-year funding from the National Research Foundation of Korea (NRF) for a collaborative research project called Global Basic Research Laboratory (GBRL). This funding will support the development of an AI-based next-generation thermal fluid system via Topology Optimization and Additive Manufacturing. [News article in Korean]
May 1, 2025
Mr. Jungmin Hong joins Jeong Research Group as a visiting student. He will research thermal monitoring in both metal AM and semiconductor packaging processes.
Jan 13, 2025
Jeong Research Group has secured 6-year funding from the Korea Institute of Machinery and Materials (KIMM). This funding will support the development of in-situ thermal characterization of the hybrid bonding processes for semiconductor packaging.
Jan 01, 2025
Sampson Canacoo and Mishfaqur Rahman join Jeong Research Group as PhD students. Sampson will research metal additive manufacturing, and Mishfaqur will research thermal monitoring in semiconductor packaging processes. Welcome Sampson & Mishfaqur!
Nov 04, 2024
A group from KIMM (Department of Ultra-precision Machines & Systems) and TU Korea (Department of Mechatronics Engineering) visited the ISEN and our lab. Looking forward to active research collaboration in the near future!
Nov 01, 2024
Dr. Jeong presented an invited talk titled "Process Monitoring and Control in Metal Additive Manufacturing" at the graduate seminar series at the Department of Engineering Technology and Industrial Distribution (ETID) at Texas A&M.
Aug 11, 2024
A group from Chonnam National University (Department of Mechanical Engineering) visited the ISEN and our lab. Looking forward to active research collaboration in the near future!
Aug 01, 2024
Dr. Seungman Kim joins Jeong Research Group as a visiting scholar. He will research thermal monitoring in semiconductor packaging processes.
Jul 11, 2024
Dr. Jeong was awarded the Young Researcher Award from the International Conference on Precision Engineering and Sustainable Manufacturing (PRESM) 2024. PRESM is the conference organized by the Korean Society of Precision Engineering (KSPE) and co-organized by the Japanese Society of Precision Engineering (JSPE) and the Taiwan Society of Precision Engineering (TSPE).
Jun 01, 2024
Dr. Dong Hee Kang joins Jeong Research Group as a postdoctoral scholar. He will research the blue laser-directed energy deposition (DED) process and monitoring development.
May 30, 2024
Jeong Research Group has secured 5-year funding from the National Research Foundation of Korea (NRF) for a collaborative research project with the Korea Institute of Machinery and Materials (KIMM). This funding will support the development of real-time temperature monitoring for semiconductor packaging processes.
Jan 01, 2024
Dr. Jihoon Jeong joins the Wm Michael Barnes '64 Department of Industrial & Systems Engineering at Texas A&M University as an assistant professor.